【英文标准名称】:StandardTestMethodsforCopper-CladThermosettingLaminatesforPrintedWiringBoards
【原文标准名称】:印刷线路板用铜覆层热固层压材料的标准试验方法
【标准号】:ASTMD5109-1999(2004)
【标准状态】:现行
【国别】:
【发布日期】:1999
【实施或试行日期】:
【发布单位】:美国材料与试验协会(US-ASTM)
【起草单位】:D09.07
【标准类型】:(TestMethod)
【标准水平】:()
【中文主题词】:涂覆的;铜;热固性聚合物;叠层板材;印制电路板
【英文主题词】:copper-cladlaminate;dielectricbreakdownparalleltolaminations;dimensionalinstability;dissipationfactor;fiberreinforced;flexuralstrength;industriallaminate;laminate;ovenblister;peelstrength;permittivity;printedcircuitboards;printe
【摘要】:1.1Thesetestmethodscovertheproceduresfortestingcopper-cladlaminatesproducedfromfiber-reinforced,thermosettingpolymericmaterialsintendedforfabricationofprintedwiringboards.Thisstandarddoesnotpurporttoaddressallofthesafetyconcerns,ifany,associatedwithitsuse.Itistheresponsibilityoftheuserofthisstandardtoestablishappropriatesafetyandhealthpracticesanddeterminetheapplicabilityofregulatorylimitationspriortouse.Forspecifichazardstatements,see7.2.1,8.1,and11.3.1.1.2Metricunitsarethepreferredunitsforthesetestmethods.Inch-poundunits,whereshown,arepresentedforinformationonly.1.3Theproceduresappearinthefollowingsections:
【中国标准分类号】:L30
【国际标准分类号】:31_180;83_140_20
【页数】:8P.;A4
【正文语种】: